Throwing power on the cathode for nickel deposition is high in the Watt Bath. The process of electroplating of nickel will release gas on both side of electrode, like on water electrolysis process. Too many hydrogen gas on the plate can cause porous plated result, gas bubble clinging to the growing of cathode deposit.
The usual recommendation for a watt bath is an addition of 0.5 ml of 30% hydrogen peroxide per liter of solution. A grade free of organic and metallic stabilizers should be used, used and localized additions next to the cathode should be avoided. An excess of hydrogen peroxide seriously increased the tensile stress and causing burring, a decrease in the limiting current density for the given plating condition, and embrittlement of the plate. For this reason, the use of a proper wetting agent should always be given first consideration. The use of hydrogen peroxide can say as anticipating agent of this process to avoid the hydrogen gas effect that merge on the cathode.
The usual recommendation for a watt bath is an addition of 0.5 ml of 30% hydrogen peroxide per liter of solution. A grade free of organic and metallic stabilizers should be used, used and localized additions next to the cathode should be avoided. An excess of hydrogen peroxide seriously increased the tensile stress and causing burring, a decrease in the limiting current density for the given plating condition, and embrittlement of the plate. For this reason, the use of a proper wetting agent should always be given first consideration. The use of hydrogen peroxide can say as anticipating agent of this process to avoid the hydrogen gas effect that merge on the cathode.