On electroplating practice we will see the bubble merge from the electrode, from the cathode or from anode can merge bubble that produce gas. As on a normal process like on water electrolize, cathode will produce hidrogen gas and anode will produce oxygen gas.
To prevent this bubling on the bath of electroplating process, we use a wetting agent. This agent can function to attract the gas from the bath and will not produce bubble. Producing buble on the electroplating process will make electroplating product worse and not smooth.
Wetting agents are used in nickel baths to prevent bubbles of hydrogen from adhering to the cathode and causing pits in the deposit. They function by reducing the surface and interfacial tension, and with the correct wetting agent the contact angle between the liberated hydrogen bubbles and the cathode is reduced to zero.
To prevent this bubling on the bath of electroplating process, we use a wetting agent. This agent can function to attract the gas from the bath and will not produce bubble. Producing buble on the electroplating process will make electroplating product worse and not smooth.
Wetting agents are used in nickel baths to prevent bubbles of hydrogen from adhering to the cathode and causing pits in the deposit. They function by reducing the surface and interfacial tension, and with the correct wetting agent the contact angle between the liberated hydrogen bubbles and the cathode is reduced to zero.